Description
Hot Air Leveling Masking Tape is based on a
paper/polyester film, coated with a heat resistant
polysiloxane adhesive. Hot Air Leveling resists
temperatures up to 300°C short term and can be removed
from the substrate without leaving any adhesive residue.
The polyester reinforcement prevents tape tearing during
removal.Application Ideas :
- Masking tape for hot air solder leveling (HASL
or HAL) of printed circuit boards.
- Suitable for masking gold fingers.
- Hot Air Leveling Tape conforms to PCB contours
and irregularities, and gives a well defined masking
line.
- Once applied to the area of the PCB to be
masked, it is recommended that a pressure roller be
applied to the tape to ensure fine edge protection.
Use of heated rollers or baking of the tape is not
required. Hot Air Leveling can be stripped from the
printed circuit board after soldering without
leaving any adhesive residue or without tearing.
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